GEORGE TOWN: German-based company Pac Tech Asia Sdn Bhd will invest a total of RM30mil in Penang by 2010. To date, the company which is involved in wafer bumping processes and the design and manufacturing of advanced packaging equipment, has invested RM20mil to set up its facility in Asia, Pac Tech Group president and chief executive officer Dr Elke Zakel said Tuesday during the opening of Pac Tech’s new facility at the Bayan Lepas Industrial Park.

“This new facility provides state-of-the-art wafer bumping and back-end processing for semiconductor companies within the Pacific Rim. The building has 40,000 sq ft of remodelled production floor space and clean room area equipped with the latest facility for producing 300mm wafers.

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